surface mount rf schottky barrier diodes technical data hsms-280x series features ? surface mount packages ? high breakdown voltage ? low fit (failure in time) rate* ? six-sigma quality level ? single, dual and quad versions ? tape and reel options available * for more information see the surface mount schottky reliability data sheet. description/applications these schottky diodes are specifically designed for both analog and digital applications. this series offers a wide range of specifications and package configurations to give the designer wide flexibility. the hsms-280x series of diodes is optimized for high voltage applications. note that agilents manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. package lead code identification, sot-23/sot-143 (top view) common cathode #4 unconnected pair #5 common anode #3 series #2 single #0 12 3 12 34 ring quad #7 12 34 bridge quad #8 12 34 12 3 12 3 12 3 package lead code identification, sot-323 (top view) package lead code identification, sot-363 (top view) common cathode f common anode e series c single b common cathode quad m unconnected trio l bridge quad p common anode quad n ring quad r 123 654 high isolation unconnected pair k 123 654 123 654 123 654 123 654 123 654
2 electrical specifications t a = 25 c, single diode [4] maximum maximum minimum maximum forward reverse typical part package breakdown forward voltage leakage maximum dynamic number marking lead voltage voltage v f (v) @ i r (na) @ capacitance resistance hsms [5] code code configuration v br (v) v f (mv) i f (ma) v r (v) c t (pf) r d ( w ) [6] 2800 a0 [3] 0 single 70 400 1.0 15 200 50 2.0 35 2802 a2 [3] 2 series 2803 a3 [3] 3 common anode 2804 a4 [3] 4 common cathode 2805 a5 [3] 5 unconnected pair 2807 a7 [3] 7 ring quad [5] 2808 a8 [3] 8 bridge quad [5] 280b a0 [7] b single 280c a2 [7] c series 280e a3 [7] e common anode 280f a4 [7] f common cathode 280k ak [7] k high isolation unconnected pair 280l al [7] l unconnected trio 280m h [7] m common cathode quad 280n n [7] n common anode quad 280p ap [7] p bridge quad 280r o [7] r ring quad test conditions i r = 10 m ai f = 1 ma v f = 0 v i f = 5 ma f = 1 mhz notes: 1. d v f for diodes in pairs and quads in 15 mv maximum at 1 ma. 2. d c to for diodes in pairs and quads is 0.2 pf maximum. 3. package marking code is in white. 4. effective carrier lifetime ( t ) for all these diodes is 100 ps maximum measured with krakauer method at 5 ma. 5. see section titled quad capacitance. 6. r d = r s + 5.2 w at 25 c and i f = 5 ma. 7. package marking code is laser marked. absolute maximum ratings [1] t c = 25 c symbol parameter unit sot-23/sot-143 sot-323/sot-363 i f forward current (1 m s pulse) amp 1 1 p iv peak inverse voltage v same as v br same as v br t j junction temperature c 150 150 t stg storage temperature c -65 to 150 -65 to 150 q jc thermal resistance [2] c/w 500 150 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = +25 c, where t c is defined to be the temperature at the package pins where contact is made to the circuit board. notes: 1. package marking provides orientation and identification. 2. see electrical specifications for appropriate package marking. pin connections and package marking, sot-363 gux 1 2 3 6 5 4 esd warning: handling precautions should be taken to avoid static discharge.
3 quad capacitance capacitance of schottky diode quads is measured using an hp4271 lcr meter. this instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. the conditions are: 20 mv r.m.s. voltage at 1 mhz. agilent defines this measurement as cm, and it is equivalent to the capacitance of the diode by itself. the equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below. in a quad, the diagonal capaci- tance is the capacitance between points a and b as shown in the figure below. the diagonal capacitance is calculated using the following formula c 1 x c 2 c 3 x c 4 c diagonal = _______ + _______ c 1 + c 2 c 3 + c 4 c 1 c 2 c 4 c 3 a b c the equivalent adjacent capacitance is the capacitance between points a and c in the figure below. this capacitance is calculated using the following formula 1 c adjacent = c 1 + ____________ 1 1 1 CC + CC + CC c 2 c 3 c 4 this information does not apply to cross-over quad diodes. spice parameters parameter units hsms-280x b v v75 c j0 pf 1.6 e g ev 0.69 i bv ae-5 i s a3e-8 n 1.08 r s w 30 p b v 0.65 p t 2 m 0.5 c j r j r s r j = 8.33 x 10 -5 nt i b + i s where i b = externally applied bias current in amps i s = saturation current (see table of spice parameters) t = temperature, k n = ideality factor (see table of spice parameters) note: to effectively model the packaged hsms-280x product, please refer to application note an1124. r s = series resistance (see table of spice parameters) c j = junction capacitance (see table of spice parameters) linear equivalent circuit, diode chip
4 typical performance, t c = 25 c (unless otherwise noted), single diode 0 0.1 0.3 0.2 0.5 0.6 0.4 0.8 0.7 0.9 i f ?forward current (ma) v f ?forward voltage (v) figure 1. forward current vs. forward voltage at temperatures. 0.01 10 1 0.1 100 t a = +125 c t a = +75 c t a = +25 c t a = ?5 c figure 2. reverse current vs. reverse voltage at temperatures. 0102030 50 40 i r ?reverse current (na) v r ?reverse voltage (v) 1 1000 100 10 100,000 10,000 t a = +125 c t a = +75 c t a = +25 c figure 3. dynamic resistance vs. forward current. 0.1 1 100 r d ?dynamic resistance ( ) i f ?forward current (ma) 10 1 10 1000 100 figure 4. total capacitance vs. reverse voltage. 0102030 50 40 c t ?capacitance (pf) v r ?reverse voltage (v) 0 1.5 1 0.5 2 v f - forward voltage (v) figure 5. typical v f match, pairs and quads. 30 10 1 0.3 30 10 1 0.3 i f - forward current (ma) ? v f - forward voltage difference (mv) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 i f (left scale) ? v f (right scale)
5 table 1. typical spice parameters. parameter units hsms-280x hsms-281x hsms-282x b v v75 25 15 c j0 pf 1.6 1.1 0.7 e g ev 0.69 0.69 0.69 i bv a 1 e-5 1 e-5 1 e-4 i s a 3 e-8 4.8 e-9 2.2 e-8 n 1.08 1.08 1.08 r s w 30 10 6.0 p b (v j ) v 0.65 0.65 0.65 p t (xti) 2 2 2 m 0.5 0.5 0.5 applications information introduction product selection agilents family of schottky products provides unique solu- tions to many design problems. the first step in choosing the right product is to select the diode type. all of the products in the hsms-280x family use the same diode chip, and the same is true of the hsms-281x and hsms-282x families. each family has a different set of characteristics which can be compared most easily by consulting the spice parameters in table 1. a review of these data shows that the hsms-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (r s ). in applica- tions which do not require high voltage the hsms-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. the hsms- 281x family is a hybrid schottky (as is the hsms-280x), offering lower 1/f or flicker noise than the hsms-282x family. in general, the hsms-282x family should be the designers first choice, with the -280x family reserved for high voltage applica- tions and the hsms-281x family for low flicker noise applications. assembly instructions sot-323 pcb footprint a recommended pcb pad layout for the miniature sot-323 (sc-70) package is shown in figure 6 (dimensions are in inches). this layout provides ample allowance for package placement by auto- mated assembly equipment without adding parasitics that could impair the performance. 0.026 0.035 0.07 0.016 figure 6. pcb pad layout (dimensions in inches). assembly instructions sot-363 pcb footprint a recommended pcb pad layout for the miniature sot-363 (sc-70, 6 lead) package is shown in figure 7 (dimensions are in inches). this layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.075 0.016 0.035 figure 7. pcb pad layout (dimensions in inches).
6 time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 8. surface mount assembly profile. smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot package, will reach solder reflow temperatures faster than those with a greater mass. agilents sot diodes have been qualified to the time-temperature profile shown in figure 8. this profile is representative of an ir reflow type of surface mount assembly process. these parameters are typical for a surface mount assembly process for agilent diodes. as a general guideline, the circuit board and components should be exposed only to the minimum tempera- tures and times necessary to achieve a uniform reflow of solder. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c.
7 package dimensions outline 23 (sot-23) outline 143 (sot-143) 3 1 2 x x x package marking code (xx) date code (x) side view top view end view these dimensions for hsms-280x and -281x families only. dimensions are in millimeters (inches) 1.02 (0.040) 0.89 (0.035) 1.03 (0.041) 0.89 (0.035) 0.60 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 2.05 (0.080) 1.78 (0.070) 1.04 (0.041) 0.85 (0.033) 0.152 (0.006) 0.086 (0.003) 0.180 (0.007) 0.085 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) * * * * 0.69 (0.027) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 0.60 (0.024) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) 0.10 (0.004) 0.013 (0.0005) 1.04 (0.041) 0.85 (0.033) 0.92 (0.036) 0.78 (0.031) 2.04 (0.080) 1.78 (0.070) dimensions are in millimeters (inches) 0.15 (0.006) 0.09 (0.003) 3.06 (0.120) 2.80 (0.110) package marking code (xx) be c e x x x date code (x) part number ordering information no. of part number devices container hsms-280x-tr2* 10000 13" reel hsms-280x-tr1* 3000 7" reel hsms-280x-blk * 100 antistatic bag x = 0, 2, 3, 4, 5, 7, 8, b, c, e, f, k, l, m, n, p, r outline sot-363 (sc-70 6 lead) outline sot-323 (sc-70 3 lead) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters (inches) package marking code (xx) x x x date code (x) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters (inches) package marking code (xx) x x x date code (x)
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies obsoletes 5968-2356e, 5968-5934e 5968-7960e (12/99) tape dimensions and product orientation for outline sot-323 (sc-70 3 lead) p p 0 p 2 f w c d 1 d e a 0 8 max. t 1 (carrier tape thickness) t t (cover tape thickness) 5 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.255 0.013 0.315 0.012 0.010 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape
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